As an important structural and functional material, large plastic profiles are widely used in fields such as architectural decoration, transportation, electronics and electrical appliances, among which LED integrated applications have been a development trend in recent years. Precision plastic extrusion technology, as the core process for producing large plastic profiles, directly affects the dimensional accuracy, mechanical properties of the profiles and the compatibility of subsequent LED integration.
In the precision plastic extrusion process, common technical points include mold design, extrusion temperature control, traction speed adjustment, etc. Insufficient surface finish and dimensional accuracy of the mold cavity may easily lead to surface ripples or dimensional deviations of the profiles, affecting the installation fit of LED components; excessively high extrusion temperature may cause degradation of raw materials and reduce the strength of the profiles, while excessively low temperature will result in poor plasticization, leading to air bubbles or weld lines.
When integrating LEDs into large plastic profiles, common problems mainly include two aspects: first, dimensional matching issues. Due to insufficient extrusion precision of the profiles, there are dimensional deviations in the mounting holes or clamping grooves of LED modules, resulting in difficult assembly or looseness; second, heat dissipation issues. Large plastic profiles have poor thermal conductivity, and the heat generated by LEDs during long-term operation cannot be effectively dissipated, which may cause light decay or shorten the service life.
To address the above problems, the solutions are as follows: In the precision extrusion process, CAD 3D simulation is used to optimize the mold runner design to ensure uniform melt flow; the PLC control system is used to precisely regulate the extrusion temperature and traction speed, ensuring that the dimensional tolerance of the profiles is controlled within ±0.1mm. For LED integration, modified plastic substrates with thermally conductive fillers can be selected to enhance heat dissipation performance. At the same time, heat dissipation grooves can be reserved in the profile structure design or a hollow structure can be adopted to enhance air convection, effectively solving the heat dissipation problem.
